Inside electronic devices, semiconductors and various electronic parts (chips) are bonded on printed circuit boards (PCB). An important role of plating is to connect these parts. Along with the miniaturization of products, the average area of chips has been reduced to one-seventh over the past 10 years. Staying one step ahead of this trend, Kiyokawa Plating Industry Comany has developed unique technology capable of handling the next-generation chip size of “0402 (0.4 mm x 0.2 mm),” which is even smaller than the current size of “0603 (0.6 mm x 0.3 mm),” as well as multi-type mass production. This latest technology has been developed to conduct plating uniformly on copper particles of 0.6 μm in diameter, thus raising expectations for its application in many fields, including medical care, biology, and the environment.
Kiyokawa Plating Industry Co., Ltd. http://www.kiyokawa.jp/index.asp
Established in 1963. The company’s development of aluminum alloy rims for motorcycles as an application of metal surface treatment technology in 1971 earned them nationwide recognition. The field of electronics-related parts has grown to become the main pillar of the company’s business, ever since entering this field in 1975. Its distinction of being a “local manufacturer” is reflected by the fact that most of the company’s 150 employees are from Fukui Prefecture, where the head office is located.
It is generally known that plating is a technology for “coating a thin film on metal surfaces.” However, it may be difficult to believe that what looks like particles in a bottle actually has plating on each piece when presented before your eyes and you are simply informed of that effect. Still, the heaping of substances inside the bottle looks simply like particles no matter how intently you view it. So, how was such plating done?
“Just like a magic trick, we cannot show you how the trick is done,” says Mr. Furuichi with a smile. The company’s main field of business is electronic parts, such as chips and semiconductor wafers. Upon receiving orders from manufacturers who use these parts, the company conducts various types of plating as requested. Basically, the company does not deal with end products, since the processing technology of plating is what it sells. The flagship product that differentiates this company from other manufacturers is its “nano plating” bonding technology for which they received the Special Prize this time.
The trend toward the miniaturization of electronic devices headed by mobile phones is indeed startling. Such miniaturization and weight reduction could not have been realized, however, had it not been for the size reduction of electronic parts embedded inside the devices. This development posed a variety of difficult problems to be overcome by the plating technology that is indispensable for bonding electronic parts or providing such parts with anti-corrosion or resistance functions.
“When it comes to the world of ‘nano,’ we simply couldn’t do anything even when combining all the technologies we have thus far acquired. The product was so weightless that it would float or inhibit electric conduction. So, we set up a development team of 10 members who specialize in technological innovation.”
The team members were selected from each of the “design” departments to develop plating technology, the “production” involved in manufacturing, and the “quality control.”
“This triune team was what was needed to develop a reliable product. People might readily associate technological development with the mere plating itself. ‘Super samples’ can be prepared by other plating companies or even Chinese manufacturers, but you can say ‘we succeeded in development’ only when you succeed in mass production of uniform quality.”
It took them five long years to develop a technology capable of handling super microchips of the “0402” size (0.4 mm x 0.2 mm).
“It was not enough just to conduct plating on the chips. What the customers want is the kind of plating that is uniform without any variation. Thus, the biggest challenge for us was how to realize such uniformity at this size. Moving forward, we often encountered an obstacle. Upon overcoming it and progressing again, there was yet another hurdle to clear. The process was a constant repetition of finding solutions.”
It was about 30 years ago that the company entered the plating market for electronics parts. It all began when President Tadashi Kiyokawa agreed to accept a request from a certain maker to undertake a specific job that had been “refused by all other plating plants.”
Ever since that time, Kiyokawa’s corporate culture of “never say never” both outside and inside the company has been nurtured.
“The task of the project we faced this time posed a considerably high hurdle, but we thought to ourselves that in this company, there is no use in saying that (laughing). We just had to do what we needed to do.”
The overall situation facing the Japanese plating industry is steadily deteriorating due to Chinese competitors taking over the conventional plating business in Japan, and the difficulty in cultivating successors to acquire established plating skills. However, plating itself is being given fresh attention.
“As the miniaturization of electronic parts continues to progress, it is becoming increasingly difficult to bond parts together with methods other than plating. Plating uses ‘liquid’ and therefore offers a great advantage of being able to penetrate gaps, regardless of how narrow. It is indeed a big business opportunity for a development-oriented company like us.”
“All the more so, we need to gather information so as not to lose that opportunity,” emphasizes Mr. Furuichi. Actually, the company was awarded the “Fukui Science and Technology Award” in 2003, the “Green Purchasing Award (for small- and medium-sized enterprises)” the following year, and other awards as well, and such challenges are also part of the company’s gathering of information.
“Through the process of applying for an award and making efforts toward that goal, we can surely feel and perceive what the current era requires of us. By reviewing the rating criteria, we can also objectively see both our strong and weak points.”
Into an even more miniaturized world, the company will never stop rising to meet new challenges.
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